How to Delid a PS3 Cell Processor Safely

Delid a PS3 Cell processor safely

Shape the blade, prepare the board, then cut the silicone holding the IHS. Most people should use the warm method.

Warm delid recommendedPS3 FAT and early SlimGloves and eyewear
Start the guideReplacement blades
Safety warning

Always wear protective gloves and eyewear during the delidding process. These precautions help prevent injuries in case of accidental slips or mishaps.

1. Prepare the Delid Tool

Shape the blade before you touch the console.

  1. Place the Delid Tool on a flat, stable surface with the grip facing up.
  2. Gently lift the handle of the blade, keeping the blade flat on the surface.
  3. Raise the handle until it forms a 45 to 60-degree angle.
  4. The blade should naturally curve between 45 to 60 degrees.
Animation showing the Delid Tool blade being gently bent to a 45 to 60 degree curve
Bend the blade gently to a 45 to 60 degree curve.
Do not bend the blade the other way

Bending the blade in the opposite direction may weaken it and cause it to break.

Animation showing the wrong way to bend the blade, which can break it
The wrong direction. This is how blades break.

2. Prepare the motherboard

  1. Disassemble the console until only the motherboard remains.
  2. Use isopropyl alcohol and a cotton swab to clean off any excess thermal paste.

Next, choose between two methods: Cold Delid or Warm Delid.

3. Choose a method

Method selection warning

A cold delid carries a higher risk than a warm delid. At room temperature, the silicone adhesive bonding the IHS (Integrated Heat Spreader) is relatively rigid and elastic, requiring greater force to cut. This increases the likelihood of damage to the processor substrate, solder balls underneath and nearby components.

For most users, a warm delid is recommended. Gentle heating softens the silicone adhesive and significantly reduces the force required.

Heating guidelines

When performing a warm delid, heat must be applied gradually and carefully. Excessive heat can cause permanent component damage.

  • The Cell processor's normal operating temperature range is approximately 70–90 °C.
  • Keeping temperatures within or below this range is sufficient to soften the adhesive.
  • Avoid prolonged or concentrated heat.
  • If the processor becomes too hot to comfortably handle, stop and allow it to cool naturally before continuing.
Recommended for most users

Warm delid

  1. Apply a small amount of heat to the IHS using a heat gun or similar tool. The goal is to warm the silicone slightly, making it easier to cut. Do not overheat the IHS; gentle warming is sufficient.
  2. Carefully insert your Delid Tool into the gap on the correct side of the processor's IHS. This side has a visible gap in the silicone and is located at the bottom of the square, corresponding to the lower edge of the text on the processor.
  3. Brace the motherboard with one hand, and with the other, gently pull the tool upwards and towards the corner of the IHS. Be sure to lift slightly as you pull to ensure you're cutting the silicone as far from the substrate as possible.
  4. Apply moderate force as you continue cutting the silicone towards the corner. Thanks to the heat, the force required should be less than with the cold delid method.
  5. Once you reach the corner, rotate the motherboard and repeat the process on the next side.
  6. Gently finish the delid once all corners have been cut.
Higher risk

Cold delid

  1. Carefully insert your Delid Tool into the gap on the correct side of the processor's IHS. This side has a visible gap in the silicone and is located at the bottom of the square, corresponding to the lower edge of the text on the processor.
  2. Brace the motherboard with one hand, and with the other, gently pull the tool upwards so the blade is applying pressure to the underside of the IHS, then cut towards the first corner of the IHS. Be sure to lift slightly as you pull to ensure you're cutting the silicone as far from the substrate as possible.
  3. Apply moderate force as you continue cutting the silicone towards the corner.
  4. Once you reach the corner, rotate the motherboard and repeat the process on the next side.
  5. Gently finish the delid once all corners have been cut.
Delidding photo 1: cutting the silicone under the IHS
Delidding photo 2: cutting the silicone under the IHS
Delidding photo 3: cutting the silicone under the IHS

Cut direction (both methods)

Always cut the silicone in a clockwise direction, following the arrow shown below. Begin at the visible silicone gap and work steadily around the IHS.

Diagram of the clockwise cutting direction around the IHS, starting at the gap on the bottom edge
Start at the bottom gap and move clockwise around the IHS perimeter.

Keep the beveled edge oriented in the direction of travel, with the bevel on the underside of the blade while cutting.

Animation of the delid cutting motion

Which consoles can be delidded?

Compatible

  • All PS3 FAT models
  • Early Slim revisions CECH-20xx and CECH-21xx
  • Slim models whose Cell processor has a green substrate

Not officially supported

  • CECH-25xx
  • CECH-30xx
  • CECH-40xx
  • CECH-42xx
  • CECH-43xx

Some Slim model PS3s use epoxy on the Cell processor die. While it is still possible to cut the silicone holding the IHS, the die epoxy remains strongly bonded. Because of this, we do not support delidding Slim PS3 models with Cell processors that have a black substrate. Cell processors with a green substrate can be delidded as normal.

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